[EXPERIMENTAL] - Minimum trace width : 3.5mil - Changed to 4 Layers PCB for higher precision fab. - Reduced BGA ball size from 0.2mm to 0.18

iCEStamp1K. Stamp size iCE40LP1K FPGA board. With on board Vcore (1v2) regulator. Castellated holes allow you to solder this board directly on the larger PCB. This way you can reduce the cost of PCB production.