TMP116 - WSON breakout V2

By MicDis

2 layer board of 0.56 x 0.31 inches (14.2 x 8.0 mm).
Shared on April 16th, 2018 08:53

With solder connections for I2C address select, really tiny VIA’s but neatly produced by OSH! Backside decoupling with 0,1uF between V+ and GND


TMP116 - WSON breakout V2

By MicDis

2 layer board of 0.56 x 0.31 inches (14.2 x 8.0 mm).
Shared on April 16th, 2018 08:53

With solder connections for I2C address select, really tiny VIA’s but neatly produced by OSH! Backside decoupling with 0,1uF between V+ and GND