Shared Projects by ryanwong99

3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

This is a USB type C female header to 6 pin pinout for SPI protocol. Do not use this for USB protocol. This is meant to be used with Scale Snap 3D to reduce RF noise across (max) 1 meter distance.