Shared projects

XMega_E5 Breakout v1.0.1

by nsayer.

2 layer board of 1.40x0.70 inches (35.59x17.78 mm).
Shared on July 19th, 2017 14:01.

The ATXMega chips are not available as through-hole devices. The ATXMega32E5 is a high powered substitute for the ATMega328P made famous by Arduino. This breakout board brings out all pins except port R (but instead adds footprints for a 1206 crystal) and the analog Vcc and ground (hooked together with bypass caps to digital Vcc and ground). In addition to breaking out the two PDI pins, a standard 2x3 PDI programming interface footprint is on the board.

Note that this is not a 5 volt tolerant chip.

This version adds some pin markings on the top side, where they aren’t in the way.

  • C1 & C2 - 0.1µF 0805
  • C3 & C4 - 15 pF 0805
  • R1 - 10 kΩ 0805
  • X1 - 32.768 kHz 1206
  • And, of course, IC1 is an ATXMegannE5

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ATXMega_E5 breakout v1.0

by nsayer.

2 layer board of 1.40x0.70 inches (35.59x17.78 mm).
Shared on June 27th, 2017 03:09.

There is a newer version here.

The ATXMega chips are not available as through-hole devices. The ATXMega32E5 is a high powered substitute for the ATMega328P made famous by Arduino. This breakout board brings out all pins except port R (but instead adds footprints for a 1206 crystal) and the analog Vcc and ground (hooked together with bypass caps to digital Vcc and ground). In addition to breaking out the two PDI pins, a standard 2x3 PDI programming interface footprint is on the board.

Note that this is not a 5 volt tolerant chip.

  • C1 & C2 - 0.1µF 0805
  • C3 & C4 - 15 pF 0805
  • R1 - 10 kΩ 0805
  • X1 - 32.768 kHz 1206
  • And, of course, IC1 is an ATXMegannE5

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Hi Density Groundplane Perfboard

by nsayer.

2 layer board of 4.09x4.09 inches (103.94x103.94 mm).
Shared on April 1st, 2017 04:26.

Ordinary perfboard suffers from a couple of problems… First, it has no groundplane, so there’s nothing to prevent excessive radiated noise. Also, today’s parts tend to have much higher density leads, meaning the holes must be drilled closer together. The added groundplane and plated through vias also will aid in heat dissipation by acting as “chimneys,” as if often done with high density surface mount power devices.

NOTE: This was an April Fools joke.

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Divide by 1.5 v1.0

by nsayer.

2 layer board of 1.05x0.75 inches (26.67x19.05 mm).
Shared on March 13th, 2017 14:03.

This design is untested, but the theory is sound.

15 MHz goes in, 10 MHz comes out.

  • IC1 - 74LS74D
  • IC2 - 74LVC2G86
  • IC3 - 74LVC2G04
  • IC4 - 74LVC1G17
  • R1 - 1 MΩ
  • R2 - 1 kΩ
  • R3 & R4 - 50 Ω
  • C1 - C4 - 0.1µF
  • C5 - 10 pF
  • C6 & C7 - 220 pF
  • C8 - 22 pF
  • L1 - 1.2 µH

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Divide by 3 v2.0

by nsayer.

2 layer board of 0.90x0.75 inches (22.89x19.05 mm).
Shared on March 12th, 2017 18:32.

Adds a self-biased inverter on the input and PI network LPF on the output. The input can be sine or square and the output will be ~13 dBm sine.

  • IC1 - 74LS74D Dual D flip-flop
  • IC2 - 74AHC1G86DBV Single 2-input XOR
  • IC3 - 74LVC2G04 Single inverter
  • C1-C3 - 0.1µF
  • C4 - 10 pF
  • R1 - 1 MΩ
  • R3 & R4 - 50 Ω
  • L1 - 1.2 µH
  • C5 & C6 - 220 pF

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