Shared projects

SNES multi region mod with SuperCIC, uIGR (V2) and region patching parts

By borti4938

2 layer board of 1.71 x 1.28 inches (43.4 x 32.4 mm).
Shared on January 7th, 2015 19:10


SNES multi region mod with SuperCIC, uIGR (V2) and region patching parts

By borti4938

2 layer board of 1.71 x 1.28 inches (43.4 x 32.4 mm).
Shared on January 7th, 2015 19:10

Solder Joints:
- Most of the solder joints are located at the cart connector as to be seen on the silkscreen.
- The mode output located at the PCBs bottom right side is goin' to the
- S-CPUN Pin 111
- S-PPU1 Pin 24 and S-PPU2 Pin 30
- One may use the additional pad for the add-on PCB for the 1Chip-SNES or to use separate wires to S-PPU1 and S-PPU2
- CIC8 and CIC10 has to be solder to the pads, not the the lifted pins
- Reset input can be solder directly to the reset buttons output instead of CIC8
- ‘Contr. Port’ means the connector for the flat wire. In the SNES-mini the mapping is as follows:
- 10 -> Player1 Pin3
- 8 -> Player1 Pin2
- 6 -> Player1 Pin4


Lifted Pins:
- S-CPUN Pin 111 OR S-PPU1 Pin 24 and S-PPU2 Pin 30
- CIC Pins 1, 2, 10 and 11 OR remove CIC completely


Values of passive components:
R1, R2: 220Ohm (increase resistor values if LED is too bright)
R3: 10kOhm
C1 - C5: 0.1uF


Active ICs (SOIC14 packages if not otherwise stated):
7404: six inverter gates, where three are unused
74HC(T)125: four buffer gate: use HC or HCT type!
74
133: 13-NAND gate, SOIC16 package

S-CIC: PIC16F630 flashed with ‘Firmware_SCIC.hex’
uIGR (V2): PIC16F684 flashed with ‘Firmware_uIGR_V2.hex’
Both firmwares can be found at https://github.com/borti4938/SNES-AddOn-PCBs/tree/master/Firmware-Switchless-PICs
!!!Note that the ‘snes-igr.hex’ in the sd2snes github repository, i.e., the ‘classical igr’ won’t work on this PCB!!!



Electronic clock switch for 1Chip-SNES, SNES Mini and Jr.

2 layer board of 1.15 x 1.04 inches (29.2 x 26.5 mm).
Shared on January 7th, 2015 19:04


Electronic clock switch for 1Chip-SNES, SNES Mini and Jr.

2 layer board of 1.15 x 1.04 inches (29.2 x 26.5 mm).
Shared on January 7th, 2015 19:04

Solder Joints:
1 - mode (in) Vcc = PAL-mode, GND = NTSC-mode, same as at S-CPUN pin111
2 - inverted mode (out) to be jointed to lifted pin9 of S-RGB IC
3 - clock (out) to be jointed S-CPUN pin9 (either remove X1 or lift pin9 on S-CPUN)


Values of passive components (all 0805 packages except crystals):
R1, R2: 330Ohm
R3, R4: 1MOhm
C1, C2: 0.1uF
C3 - C6: 22pF (exact value: C3=C4=C5=C6= 2*(CL-CS), where CL is load cap. and CS is stray cap. of 74HCU04)
X50: 17.734MHz
X60: 21.477MHz


Active ICs (SOIC14 packages):
74*00: four 2-NAND gates, use 7400, 74LS00, 74HC00, and so on
74HCU04: six inverter, using unbuffered inverter as displayed performs best